Shenzhen Anxinruo Technology Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home / Products / Memory IC / K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original /

show pictures

Contact Now
Shenzhen Anxinruo Technology Co., Ltd.
Visit Website
City:shenzhen
Country/Region:china
Contact Person:MrGuo.
Contact Now

K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original

K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
  • K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
  • K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
  • K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
  • K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
  • K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
  • K4Z80325BC-HC14 BGA-180 Memory IC Ball Planting Tin Steel Mesh Test Chip Brand New Original
Products Detailed
Product Description Product type: Steel mesh with ball planting and tin planting. Model Number: K4Z80325BC-HC14 Series: K4Z80325 Vendor: SAMSUNG ...
View Products Detailed →